IEC 61249-2-21:2003
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
发布时间：2003-11-12 实施时间：


IEC 61249-2-21:2003 标准是印制电路板和其他互连结构制造中使用的一种增强基材的标准。该增强基材是一种非卤素环氧树脂玻璃纤维增强层压板，其铜覆盖层可用于制造印制电路板和其他互连结构。该标准规定了该材料的垂直燃烧测试方法和定义的可燃性等级。

该标准规定的增强基材具有以下特点：

1. 非卤素环氧树脂作为基材，不含卤素元素，不会产生有毒气体，符合环保要求；
2. 玻璃纤维增强，具有较高的强度和刚度；
3. 铜覆盖层良好，可用于制造印制电路板和其他互连结构；
4. 经过垂直燃烧测试，定义了可燃性等级，具有较好的防火性能。

该标准规定的垂直燃烧测试方法是指将增强基材垂直放置，点燃其下端，观察其燃烧情况。根据燃烧时间、燃烧高度和残留物等指标，定义了可燃性等级。该标准规定的可燃性等级分为V-0、V-1和V-2三个等级，其中V-0等级要求最高，V-2等级要求最低。

该标准规定的增强基材可用于制造印制电路板和其他互连结构。印制电路板是现代电子产品中不可或缺的组成部分，其质量和性能直接影响到整个电子产品的质量和性能。使用符合该标准的增强基材制造印制电路板，可以保证其防火性能和环保性能，提高整个电子产品的质量和性能。

相关标准
- IEC 61249-2-22:2003 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad, for lead-free assembly
- IEC 61249-2-23:2003 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad, for high-speed and high-frequency applications
- IEC 61249-2-24:2003 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad, for high thermal reliability applications
- IEC 61249-2-25:2003 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad, for high-frequency applications
- IEC 61249-2-26:2003 Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad, for high thermal conductivity applications